Introduction to Laser Decap: The laser decapsulation machine is used to remove the encapsulation material from electronic components, specifically by using laser technology. In recent years, there has been an increase in copper wire products, and customers have increasingly higher requirements for decapsulation, leading to the demand for laser decapsulation machines. These machines are favored by customers due to their safety, convenience, and high reliability.
ICDECAP LIMITED is a Hong Kong-based company specializing in failure analysis and decapsulation equipment. With over ten years of experience in automated decapsulation development and manufacturing, we provide comprehensive products, methods, and technical support to meet the decapsulation requirements of semiconductor devices.ICDECAP LIMITED Limited offers laser decap, plasma decap, as well as laser plasma decapsulation machines, to meet the evolving needs in the field of semiconductor device failure analysis.
Features of Laser Decapsulation Machine:
- Provides excellent decapsulation results for copper wire packaging.
- Convenient decapsulation for complex samples.
- High repeatability and consistency.
- Computer-controlled decapsulation shape, position, size, time, etc., for easy operation.
- Low environmental and human pollution, ensuring high safety.
- Minimal consumables, resulting in low operating costs.
- Compact size, easy to place.
Laser decap technology has extensive applications in chip decapsulation processes, but several important considerations should be taken into account when using lasers for decapsulation:
Safety precautions: Laser beams have high energy and focus, therefore appropriate safety measures must be taken during the operation. Operators should wear suitable laser safety glasses to protect their eyes from laser beam hazards. Additionally, the equipment should have safety features such as emergency stop buttons and protective enclosures to ensure the safety of personnel and equipment.
Selection of laser parameters: When using lasers for chip decapsulation, suitable laser parameters should be selected based on specific requirements. Laser power, frequency, pulse width, and other parameters should be adjusted according to the characteristics of the chip material and decapsulation requirements. Improper laser parameters, either too high or too low, may result in reduced decapsulation quality or chip damage.
Control of laser position and focus: The position and focus of the laser beam have a significant impact on the decapsulation results. It is important to accurately irradiate the target area with the laser beam and align the focus appropriately with the encapsulation material to achieve precise decapsulation. The use of suitable laser focusing systems and positioning devices can improve the accuracy and stability of the decapsulation process.
Temperature control: During laser decapsulation, the high energy of the laser beam may generate heat effects. To avoid chip overheating and damage, temperature control during the laser decapsulation process is necessary. Temperature can be controlled by adjusting laser power, scanning speed, and cooling devices to ensure that the chip remains within a safe temperature range during decapsulation.
Material adaptability: Different types of chip materials respond differently to lasers. When selecting laser decapsulation techniques, the characteristics and adaptability of the chip material should be considered. Some materials may be more sensitive to lasers, making them prone to thermal stress and damage. Therefore, appropriate parameter adjustments and testing should be performed to ensure the stability and reliability of the decapsulation process.
In conclusion, laser decapsulation is a high-precision and high-efficiency technique for chip decapsulation. However, it is important to observe safety precautions, select laser parameters appropriately, control laser position and focus, maintain temperature control, and consider the adaptability of chip materials. By following these considerations, the safety and reliability of the laser decapsulation process can be ensured, and high-quality decapsulation results can be achieved.